Measurement of demolding forces in full wafer thermal nanoimprint


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Output type: Journal article

UM6P affiliated Publication?: No

Author list: V. Trabadelo, H. Schift, S. Merino, S. Bellini, J. Gobrecht

Publisher: Elsevier

Publication year: 2008

Journal: Microelectronic Engineering (0167-9317)

Volume number: 85

Issue number: 5-6

Start page: 907

End page: 909

Number of pages: 3

ISSN: 0167-9317


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Last updated on 2021-15-06 at 23:16